AMD “actively working” on its next generation of X3D processors

AMD “actively working” on its next generation of X3D processors
AMD “actively working” on its next generation of X3D processors

3D V-Cache technology, explained simply, consists of third-level cache memory stacking. Expanding this type of internal memory in the processor improves gaming performance.

Initially, AMD did not comment on the processors that will use this technology in the new range of chips. But, since processors with stacked cache sell very well and perform great, they are committed to continuing to launch new solutions and improving the design.

AMD would already be preparing the Ryzen 9000X3D

Donny Woligroski, senior technical marketing manager at AMD, spoke with PCGamer colleagues. They have talked, among many other topics, about chips based on the Zen 5 architecture with 3D V-Cache technology. Woligroski has been very enthusiastic about these new chips.

We have a lot to say about X3D. The best part is that we are not resting on our laurels. We’re improving what we can do with X3D, it’s really exciting and I’m really looking forward to it. talk to people about it.

Donny Woligroski, Senior Technical Marketing Manager, AMD

He has not gone into details, since at the moment this technology is confidential until it is officially presented. Woligroski highlighted that “we are actively working […] to make it even better” referring to 3D V-Cache technology.

AMD, whenever it launches a new technology, works to improve it and expand its capabilities. The question that remains is how it will differ from the predecessor versions and what improvements it will offer.

We could see, first of all, an increase in bandwidth for this 3D V-Cache memory as we have seen with the L1 and L2 caches in the Ryzen 9000. In addition to this, we could see different sizes of the third level cache differentiating from existing models.

The maximum 3D V-Cache memory capacity is limited to 64 MB. This can be seen with the Ryzen 9 7950X3D which has 128 MB of L3 cache, of which 64 MB are V-Cache type. While the processor that integrates the most 3D memories is the EPYC 9684X, which reaches 1,152 MB, which costs about 15,000 euros.

It is possible that the new 3D V-Cache will have a size of 128 MB or even more. It does not seem feasible, at the moment, that we will see over 1 GB of third-level cache in a domestic processor.

So far the 3D V-Cache is exclusive for Ryzen 9000 desktop processors. It is not available in APUs or in laptop chips. Something positive would be if the use were extended to the two other segments in which the company offers solutions.

It may not be possible because an iGPU is always integrated into APUs for desktops and laptops. In addition, the new XDNA cores for Microsoft Copilot+ artificial intelligence are added to the Ryzen AI 300.

 
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