Intel has introduced the first fully integrated optical computer interconnect (OCI) chiplet for more scalable artificial intelligence (AI) infrastructure for data centers and high-performance computing (HPC) applications.
The optical chiplet addresses the emerging need for higher bandwidth, lower power consumption and greater reach in CPU/GPU connectivity, enabling future scalability of AI and novel computing architectures.
The first bidirectional 4Tbps OCI chiplet packaged with a conceptual CPU has been presented at the Optical Fiber Communication Conference (OFC2024), where it has shared that customers will be able to “seamlessly integrate co-packaged silicon photonic interconnect solutions into computing systems next generation”.
It is the first OCI optical ‘chiplet’ capable of supporting 64 channels of 32 Gbps data transmissions in each direction in optical fibers up to one hundred meters, as detailed by the company in a statement.
Intel advances high-bandwidth interconnect by enabling co-packaged optical input/output in emerging AI infrastructure for data centers and HPC. With it, it aims to contribute to the global deployment of applications based on artificial intelligence and accelerate generative AI.
