We will soon see a new generation of HONOR foldables hit the market with the Honor Magic V3. It will be a renewal focused again on its design, and it could be even thinner than the current Magic V2.
HONOR Magic V3 could be even thinner than the V2
Today, MyDrivers reports that in a meeting after the launch of the Magic V Flip, George Zhao revealed that The Honor Magic V3 is currently in intensive development and promised to be an impressive and cutting-edge foldable phone.
Furthermore, he highlighted Honor’s commitment to innovation by stating that even after 11 months and 20 days since the 9.9mm thick test, the Magic V2 is still the thinnest foldable phone on the market.
And this is where the key lies, as he reiterated Honor’s dedication to breaking its own records, highlighting it as a fundamental value of the company. As for a possible date for its presentation, rumors point to the month of July as the probable one.
The bad news is that we don’t know much about the possible specifications of the HONOR Magic V3. Rumors point to a Snapdragon 8 Gen 3 processor and a battery that will exceed 5,000 mAh. But for now, none of this is final.
Remember that you can read our complete review of the HONOR Magic V2 here.
